发明名称 SOLID-STATE IMAGE PICK-UP DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent undesired influences caused from a light-shielding film for forming an OPB zone when forming other components.SOLUTION: The solid-state image pick-up device includes: an effective pixel region in which many pixels are dispose in a matrix; and an OPB zone which is formed by covering peripheral pixels in the effective pixel region with a light-shielding film. At least one side of the outer periphery side and the inner periphery side of the OPB zone is formed in an arc-like shape. This disclosure is applicable to, for example, backside-illumination type CMOS image sensor.
申请公布号 JP2016012628(A) 申请公布日期 2016.01.21
申请号 JP20140132762 申请日期 2014.06.27
申请人 SONY CORP 发明人 NAKANO TAKUYA
分类号 H01L27/14;H04N5/361;H04N5/369 主分类号 H01L27/14
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