发明名称 PLACING BED STRUCTURE, TREATING APPARATUS USING THE STRUCTURE, AND METHOD FOR USING THE APPARATUS
摘要 Provided is a holding stage structure which holds a substrate and disposed in a process chamber that is vacuum-evacuatable and allows a predetermined process to be performed on the substrate therein. The holding stage structure includes: a holding stage body on which the substrate is placed; an elevation pin mechanism lowering the substrate on the holding stage body or raising the substrate from the holding stage body; and a stepped portion formed on the holding stage body so that a peripheral portion of a rear surface of the substrate placed on the holding stage body is exposed to a processing gas supplied into the process chamber.
申请公布号 US2016020135(A1) 申请公布日期 2016.01.21
申请号 US201514854226 申请日期 2015.09.15
申请人 TOKYO ELECTRON LIMITED 发明人 KAWAMURA Kohei;KOBAYASHI Yasuo;NOZAWA Toshihisa;ISHIBASHI Kiyotaka
分类号 H01L21/687;H01L21/683;C23C16/50;C23C16/455;H01J37/32;C23C16/458 主分类号 H01L21/687
代理机构 代理人
主权项 1. A holding stage structure which holds a substrate and is disposed in a process chamber, the process chamber being vacuum-evacuatable and allowing to perform on the substrate therein a predetermined process which generates water molecules as byproduct, the holding stage structure comprising: a holding stage body on which the substrate is to be placed; and a stepped portion formed by projecting a central portion, other than a peripheral portion, of the holding stage body so that a peripheral portion of a rear surface of the substrate placed on the holding stage body is exposed to a processing gas supplied into the process chamber, wherein in a plan view the stepped portion is within an area of the substrate placed on the holding stage body, wherein the stepped portion includes thereon a plurality of projecting portions defining spaces into which water vapor generated from the rear surface of the substrate is to be released when the substrate contacts the plurality of projecting portions, with the spaces being underneath the substrate, and the spaces into which water vapor is to be released when the substrate contacts the plurality of projecting portions communicate horizontally with an inside space of the process chamber, or wherein the holding stage body comprises a plurality of first groove portions formed in the stepped portion, and, when spaces are defined between the plurality of first groove portions and the substrate placed on the holding stage body, the spaces penetrates in a plan view the projected central portion to communicate horizontally with an inside space of the process chamber.
地址 Tokyo JP