| 摘要 |
Disclosed are a light-emitting element manufacturing method, to which a wafer level package process is applied, and a light-emitting element manufactured by the same. The light-emitting element comprises a nitride-based semiconductor structure, first and second metal bumps, a wavelength conversion unit, and a lens unit, and the first and second metal bumps protrude downwards compared with the wavelength conversion unit and the lens unit. According to the light-emitting element of the present invention, chips can emit white light of the same wavelength, and the reliability and optical efficiency of the light-emitting element are improved. |
