发明名称 |
HOUSING MATERIAL, ELECTRONIC DEVICE HOUSING, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide: a housing material which makes possible to ensure a sufficient conductivity and to achieve the reduction in thickness; an electronic device housing arranged by use of such a material; and an electronic device arranged by use of such an electronic device housing.SOLUTION: A housing material 10 comprises a laminate of prepregs 40a and 40b each including carbon fiber 36 consisting of a conductive reinforced fiber and a thermosetting resin 38 impregnated into the carbon fiber, and is used as an electronic device housing 12 of an electronic device 16. The housing material 10 further comprises: a conductive earth member 44 provided on part of its surface and electrically connected to the carbon fiber 36; and a piece of aluminum foil 42 sandwiched between the prepregs 40a and 40b and integrated with them into the laminate. |
申请公布号 |
JP2016012632(A) |
申请公布日期 |
2016.01.21 |
申请号 |
JP20140132882 |
申请日期 |
2014.06.27 |
申请人 |
LENOVO SINGAPORE PTE LTD |
发明人 |
MIZOGUCHI FUMITAKE;OTSUKA AKIRA;NOHARA RYOTA;HORIKOSHI SHOTA |
分类号 |
H05K9/00;G06F1/16;H05K5/02 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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