发明名称 HOUSING MATERIAL, ELECTRONIC DEVICE HOUSING, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide: a housing material which makes possible to ensure a sufficient conductivity and to achieve the reduction in thickness; an electronic device housing arranged by use of such a material; and an electronic device arranged by use of such an electronic device housing.SOLUTION: A housing material 10 comprises a laminate of prepregs 40a and 40b each including carbon fiber 36 consisting of a conductive reinforced fiber and a thermosetting resin 38 impregnated into the carbon fiber, and is used as an electronic device housing 12 of an electronic device 16. The housing material 10 further comprises: a conductive earth member 44 provided on part of its surface and electrically connected to the carbon fiber 36; and a piece of aluminum foil 42 sandwiched between the prepregs 40a and 40b and integrated with them into the laminate.
申请公布号 JP2016012632(A) 申请公布日期 2016.01.21
申请号 JP20140132882 申请日期 2014.06.27
申请人 LENOVO SINGAPORE PTE LTD 发明人 MIZOGUCHI FUMITAKE;OTSUKA AKIRA;NOHARA RYOTA;HORIKOSHI SHOTA
分类号 H05K9/00;G06F1/16;H05K5/02 主分类号 H05K9/00
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