| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve easy performance confirmation of a product.SOLUTION: A semiconductor device comprises a substrate 11, first pads 71, a semiconductor package 12 and second pads 72. The substrate 11 has a first surface 11a and a second surface 11b located on the side opposite to the first surface 11a. The first pads 71 are provided on the first surface 11a of the substrate 11. The semiconductor package 12 has a controller 31 and solder balls 61 which are electrically connected to the controller 31 and placed on the second pads 72. Third pads 73 are provided on the second surface 11b of the substrate 11 and electrically connected with the second pads 72. |
