发明名称 |
CAPACITANCE DEVICE IN A STACKED SCHEME AND METHODS OF FORMING THE SAME |
摘要 |
Embodiments of the present disclosure include devices and sensor packages and methods of forming the same. An embodiment is a device including a first semiconductor chip. The first semiconductor chip includes a first substrate, a first conductive pad over the first substrate. The device further includes a second semiconductor chip having a second surface bonded to a first surface of the first semiconductor chip. The second semiconductor chip includes a second substrate and a second conductive pad over the second substrate. The second conductive pad and the first conductive pad form a first capacitor. |
申请公布号 |
US2016020235(A1) |
申请公布日期 |
2016.01.21 |
申请号 |
US201414333307 |
申请日期 |
2014.07.16 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yamashita Yuichiro |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A device comprising:
a first semiconductor chip comprising:
a first substrate; anda first conductive pad over the first substrate; and a second semiconductor chip having a second surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip comprising:
a second substrate; anda second conductive pad over the second substrate, the second conductive pad and the first conductive pad forming a first capacitor. |
地址 |
Hsin-Chu TW |