| 发明名称 |
APPARATUS FOR CONTROLLING HEAT FLOW |
| 摘要 |
An apparatus configured to control a heat flow is provided. The apparatus may include a semiconductor device region formed in a matrix; a heat rectifier region formed adjacent to the semiconductor device region; and a heat flow blocker formed in at least one region contacting the semiconductor device region and the heat rectifier region. |
| 申请公布号 |
US2016020202(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514804830 |
申请日期 |
2015.07.21 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. ;SNU R&DB FOUNDATION |
发明人 |
PARK Yeonsang;LEE Byoungho;HWANG Sungwoo;ROH Younggeun;LEE Changwon |
| 分类号 |
H01L27/02;H01L23/373;H01L23/367 |
主分类号 |
H01L27/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus configured to control a heat flow, the apparatus comprising:
a semiconductor device region formed in a matrix; a heat rectifier region formed adjacent to the semiconductor device region; and a heat flow blocker formed in at least one region contacting the semiconductor device region and the heat rectifier region. |
| 地址 |
Suwon-si KR |
