发明名称 |
Carrier Head, Chemical Mechanical Polishing Apparatus and Wafer Polishing Method |
摘要 |
Provided is a carrier head. The carrier head includes: a body having a ring shape, wherein a first locking part is formed on an external surface of the body; a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit; a regulating member located in a space between the first locking part and the second locking part; a retainer ring having a ring shape and located at the external bottom of the support unit; and an elevating unit coupling the retainer ring to the support unit to enable a height to be regulated relative to the support unit. |
申请公布号 |
US2016020133(A1) |
申请公布日期 |
2016.01.21 |
申请号 |
US201514747200 |
申请日期 |
2015.06.23 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Jongbok;Ban Junho;Lee Sangseon |
分类号 |
H01L21/687;H01L21/306;B24B37/30 |
主分类号 |
H01L21/687 |
代理机构 |
|
代理人 |
|
主权项 |
1. A carrier head comprising:
a body having a ring shape, wherein a first locking part is formed on an external surface of the body; a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit; a regulating member located in a space between the first locking part and the second locking part; a retainer ring having a ring shape and located at an external bottom of the support unit; and an elevating unit coupling the retainer ring to the support unit to enable a height of the retainer ring to be regulated relative to the support unit. |
地址 |
Suwon-si KR |