发明名称 OPTICAL MODULE AND PROJECTION IMAGE DISPLAY DEVICE
摘要 An optical module has light source mounting parts that include a reinforcement plate for a circuit board on which a light source is mounted, and is attached to a lateral surface of a housing. The optical module includes a protrusion and a thermally conductive member. The protrusion is formed on the outer circumference of the lateral surface of the housing. The thermally conductive member includes a first surface and a second surface. The first surface is thermally conductively connected to a surface of the reinforcement plate. The second surface is thermally conductively connected to the protrusion. The thermally conductive member has an inclined surface on the back side of the first surface. The inclined surface is formed along the first surface in such a manner that the thickness between the first surface and the inclined surface increases with a decrease in the distance to the second surface.
申请公布号 US2016021349(A1) 申请公布日期 2016.01.21
申请号 US201514750316 申请日期 2015.06.25
申请人 Hitachi-LG Data Storage, Inc. 发明人 KATOU Seiichi;OGASAWARA Hiroshi;ICHIKAWA Fumihito
分类号 H04N9/31;G02B27/01 主分类号 H04N9/31
代理机构 代理人
主权项 1. An optical module having a plurality of light source mounting parts, which each include a light source, a circuit board on which the light source is mounted, and a reinforcement plate attached to the circuit board to reinforce the circuit board, the light source mounting parts being attached to a lateral surface of a housing containing optical parts to let the optical module combine light from a plurality of light sources and irradiate a desired region with the combined light, the optical module comprising: a protrusion that is formed on the outer circumference of the lateral surface of the housing to which the light source mounting parts are attached; and a thermally conductive member that includes a first surface and a second surface, the first surface being thermally conductively connected to a surface different from a surface of the reinforcement plate that is attached to the circuit board, the second surface being thermally conductively connected to the protrusion; wherein the thermally conductive member has an inclined surface on the back side of the first surface, the inclined surface being formed along the first surface in such a manner that the thickness between the first surface and the inclined surface increases with a decrease in the distance to the second surface.
地址 Tokyo JP