ORBITAL POLISHING WITH SMALL PAD

摘要

A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.

主权项

1. A chemical mechanical polishing system, comprising:
a substrate support configured to hold a substrate in a substantially fixed angular orientation during a polishing operation; a movable pad support configured to hold a polishing pad having a diameter no greater than a radius of the substrate; and a drive system configured to move the pad support and polishing pad in an orbital motion while the polishing pad is in contact with an upper surface of the substrate, the orbital motion having a radius of orbit no greater than a diameter of the polishing pad and maintaining the polishing pad in a fixed angular orientation relative to the substrate.