| 发明名称 |
PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACKAGE USING THE SAME |
| 摘要 |
There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer. |
| 申请公布号 |
US2016021749(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514736128 |
申请日期 |
2015.06.10 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BONG Kang Wook;KANG Myung Sam;JI Yong Wan;JUNG Hye Won;PARK Yong Jin;KO Young Gwan |
| 分类号 |
H05K1/16;H05K1/11;H05K3/42;H05K1/18 |
主分类号 |
H05K1/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package board, comprising:
a first insulating layer formed with a cavity; and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer. |
| 地址 |
Suwon-Si KR |
