LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES

摘要

A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.

主权项

1. A micro-fluid ejection head for use in a micro-fluid ejection device, comprising:
an ejection chip to expel fluid toward a print media during use; and a laminate construct, the laminate construct having a plurality of vertically configured wiring layers interspersed with non-conductive layers, an upper layer of the wiring layers being conductive to electrically connect to the ejection chip wherein each of the ejection chip and laminate construct have an ink feed slot in fluid communication with one another to convey said fluid through the laminate construct to the ejection chip, an undersurface of the ejection chip and the laminate construct being connected.