| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a package substrate for mounting a semiconductor element which enables a flip chip connection terminal to be formed with secured adhesion in spite of its fine structure, deals with the densification by supplying an amount of solder requiring for the flip-chip connection with a bump of the semiconductor element at high accuracy, and achieves high reliability. <P>SOLUTION: A manufacturing method of a package substrate includes: a process (A) where a flip chip connection terminal is formed by an embedded circuit 2 having an upper surface exposed on an insulation layer 3; a process (B) where solder particles 7 held on sheets 5, 6 are pressed against the flip chip connection terminal and heat and pressure are applied thereon; a process (C) where the solder particles are moved to the flip chip connection terminal to eliminate the sheets; and a process (D) where the solder particles moved to the flip chip connection terminal is reflowed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
