| 摘要 |
The present invention relates to a burn-in test module used in a burn-in test chamber. The burn-in test module comprises: a socket which is installed in a burn-in test board (BIB), on which a semiconductor chip as an inspection target is mounted, and which forms a first via hole, into which a first coupling fixture is inserted; a board which is installed in a lower portion of the socket and fixedly coupled to the first coupling fixture, which is inserted into the first via hole; and a heat radiation plate which radiates heat generated in a driving device and forms a second via hole into which a second coupling fixture is inserted. The second coupling fixture inserted into the second via hole is fixedly coupled to the board. |
