| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the accuracy of a cut shape. <P>SOLUTION: This sheet cutting device 10 includes a cutter blade 12 for cutting an adhesive sheet AS affixed to a semi-conductor wafer WF, an articulated robot 13 capable of forming a cutout CU in the adhesive sheet AS by holding and operating the cutter blade 12, a detection means 15 for detecting the posture of the cutter blade 12 held by the articulated robot 13, and a control means 16 capable of storing the reference posture of the cutter blade 12. The control means 16 is provided so as to correct the posture of the cutter blade 12 to the reference posture by controlling the articulated robot 13 based on the result of detection of the detection means 15. <P>COPYRIGHT: (C)2013,JPO&INPIT |
