发明名称 部品実装装置及び部品実装方法
摘要 The present invention aims to provide an element installation device and an element installation method, which can perform element installation to substrates both of a small size and a large size, and thus can the production line of the substrates of both sizes to be uniform. Under the condition that a substrate receiving part (21) sets the gap between two substrate receiving stations (21s) to be a first gap so as to receive two substrates (2) of the small size, a left substrate transferring part (82a) transfers the two substrates (2) of the small size received by the substrate receiving part (21) simultaneously to an element installation part (22); and under the condition that the substrate receiving part (21) sets the gap between the two substrate receiving stations (21s) to be a second gas larger than the first gap so as to receive two substrates (2) of the large size, the left substrate transferring part (82a) transfers the two substrates (2) of the large size received by the substrate receiving part (21) one by one to the element installation part (22)
申请公布号 JP5845446(B2) 申请公布日期 2016.01.20
申请号 JP20120229450 申请日期 2012.10.17
申请人 パナソニックIPマネジメント株式会社 发明人 味村 好裕;濱崎 庫泰
分类号 G09F9/00 主分类号 G09F9/00
代理机构 代理人
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