发明名称 SEMICONDUCTOR PACKAGE WITH INCORPORATED LIGHT OR TEMPERATURE SENSORS AND TIME MULTIPLEXING
摘要 <p>Proposed is a package (10) having at least two pins (11, 12). The package comprises a semiconductor structure (20) having a first function and an electrical circuit (30) comprising at least one circuit element having a second function. The structure (20) and the circuit (30) are electrically connected to the pins (11, 12). Moreover, the package is operable to perform the first and second function by time multiplexing a first (60) and second (70) operating signal through the pins (11, 12). Finally, the first function is a lighting function and the second function is a sensing function. The invention is especially advantageous as it provides a cost effective and versatile miniaturized light emitting package comprising LEDs or laser diodes.</p>
申请公布号 EP2238384(B1) 申请公布日期 2016.01.20
申请号 EP20090707009 申请日期 2009.01.23
申请人 KONINKLIJKE PHILIPS N.V.;PHILIPS LUMILEDS LIGHTING COMPANY, LLC. 发明人 KMETEC, JEFFREY, D.;VOS, FRANS, M.
分类号 F21K99/00;H01L25/16;H01L33/00;H05B33/08;H05B37/03 主分类号 F21K99/00
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