| 摘要 |
FIELD: process engineering.SUBSTANCE: claimed invention can be used for bonding of two metal parts with application of friction heat. Surfaces to be bonded are heated by relative displacement. Temperatures (Wa), (Ta) of two metal parts (W), (T) at the start of first step reaches at least, 20%, preferably, 40% of the parts (W), (T) material melting point. The depth (h) of heating at said step reaches at least 1.0 mm. At second step, the parts are continuously pressed against each other.EFFECT: bonding without the increase in bonding load for fast softening of the surfaces and smooth ejection of burrs.6 cl, 8 dwg |
