| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem occurring when forming an Ag plating layer with good reflectivity on a mounting substrate of an LED light-emitting device that the Ag plating layer is easy to corrode thereby to reduce a lifetime.SOLUTION: An LED light-emitting device in which an LED is mounted on a mounting substrate provided with a die bonding electrode and a wire bonding electrode comprises: an Ag plating layer with good reflectivity formed on the die bonding electrode; an Au plating layer with good bondability formed on the wire bonding electrode; an SiOfilm covering the mounting substrate to cover the Ag plating layer and expose the Au plating layer; an LED die bonded on the SiOfilm covering a surface of the Ag plating layer; and each electrode of the LED wire bonded to the Au plating layer exposed in an opening on the SiOfilm. |
