| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent breakage and peeling of mounting components and to perform double-sided mounting using an anisotropic conductive film. <P>SOLUTION: A connection device includes: a pedestal 2 for supporting a substrate 10; a head 3 for pressurizing a connection member 13 disposed through an adhesive 17 on the other surface of the substrate 10 on the opposite side of a mounting part 12 where electronic components 11 are mounted; and a buffer material 4 for supporting the mounting part 12 of the substrate 10. For the buffer material 4, a surface 4a for supporting the mounting part 12 is flattened, and a recess 5 corresponding to the shape of the electronic component 11a is provided on a surface on the opposite side of the flat surface 4a. The depth d1 of the recess 5 is equal to or larger than a height difference td between the electronic component 11a of the mounting part 12 and another electronic component 11 which is mounted on one surface with the electronic component 11a of the mounting part 12 and is lower than the electronic component 11a of the mounting part 12. The thickness (t1-d1) of a buffer material body part 4c for which the depth d1 of the recess 5 is subtracted from the thickness t1 of the buffer material 4 is equal to or larger than the height t2 of the electronic component 11a of the mounting part 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
