SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN MONO PACKAGE AND THEREFORE MANUFACTURING METHOD

摘要

A multichannel semiconductor device is disclosed. The multichannel semiconductor device comprises: a first die which has a first channel to function as a first chip; and a second die which has a second channel independent from the first channel to function as a second chip and of which a storage capacity and a size are the same as the first die. The first and second dies are arranged in one package, and an interconnection unit exists in the one package to transfer signals to counterpart chips between the first and second dies. According to the present invention, a manufacturing yield is increased to minimize or reduce cost rising burden.