发明名称 SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE
摘要 One variation of a system for cooling an electrical component within a computing device - including a digital display - includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the digital display, including a transparent material, and defining a fluid channel extending across a portion of the digital display, the fluid channel including a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage; a transparent fluid; and a displacement device configured to circulate the transparent fluid between the internal heatsink and the fluid channel.
申请公布号 EP2973689(A1) 申请公布日期 2016.01.20
申请号 EP20140774761 申请日期 2014.02.19
申请人 TACTUS TECHNOLOGY, INC. 发明人 YAIRI, MICAH;CIESLA, CRAIG;CONSTANTINE, PERRY, GEORGE;WEIGAND, DAVE, LIND
分类号 G06F1/20;G02F1/1333;G06F3/01;H01L23/473;H05K7/20 主分类号 G06F1/20
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