发明名称 |
SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE |
摘要 |
One variation of a system for cooling an electrical component within a computing device - including a digital display - includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the digital display, including a transparent material, and defining a fluid channel extending across a portion of the digital display, the fluid channel including a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage; a transparent fluid; and a displacement device configured to circulate the transparent fluid between the internal heatsink and the fluid channel. |
申请公布号 |
EP2973689(A1) |
申请公布日期 |
2016.01.20 |
申请号 |
EP20140774761 |
申请日期 |
2014.02.19 |
申请人 |
TACTUS TECHNOLOGY, INC. |
发明人 |
YAIRI, MICAH;CIESLA, CRAIG;CONSTANTINE, PERRY, GEORGE;WEIGAND, DAVE, LIND |
分类号 |
G06F1/20;G02F1/1333;G06F3/01;H01L23/473;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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