发明名称 Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device
摘要 A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.
申请公布号 EP2750211(A3) 申请公布日期 2016.01.20
申请号 EP20130199343 申请日期 2013.12.23
申请人 NITTO DENKO CORPORATION 发明人 KATAYAMA, HIROYUKI;NORO, HIROSHI;ITO, HISATAKA
分类号 H01L33/52 主分类号 H01L33/52
代理机构 代理人
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