| 摘要 |
The present invention relates to a laser drilling apparatus and, more specifically, relates to a non-stop laser drilling apparatus capable of reducing a region of loss of a film by continuously forming a through hole or a via hole on a desired position of a film type flexible printed circuit board using a laser, and changing a feeding position of the film at the same time. According to the present invention, the non-stop laser drilling apparatus with improved rate of loss of the film comprises: unwinding rollers in which a film is wound; a first film feeding supplying unit feeding the film while maintaining tension of the film unwound from the unwinding rollers; a pair of first equilibrium maintaining rollers loading the film while maintaining equilibrium of the film to accomplish the through hole or via hole processing in a first region by a first laser head while maintaining a tension from the first film feeding supplying unit; a pair of second equilibrium maintaining rollers spaced from the first equilibrium maintaining rollers by a predetermined distance, and loading the film while maintaining equilibrium of the film to accomplish the through hole or via hole processing in a second region by a second laser head; a varying device interposed between the first and second equilibrium maintaining rollers, and moving up and down by a motor while adhering the film to a lower side to change the position of the film; a second film feeding supplying unit located on a rear side of the second equilibrium maintaining rollers and feeding the film to be rewound in a winding roller while maintaining the tension; and the winding roller in which the film, on which the through hole or the via hole is formed, is rewound. |
