| 摘要 |
<p>The invention relates to thermally conductive films for cooling and fastening electronic components. An example of such a thermally conductive film (200) comprises at least one discrete cooling region (202, 204) and at least one discrete fastening region (206). Said regions extend in a planar manner in a plane of the film (200). The cooling region (202, 204) has a better thermal conduction property than the fastening region (206), and the fastening region (206) has a better fastening property than the cooling region (202, 204).</p> |
