| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive uneven layer that is formed on an electrical connection surface of various kinds of members and can reduce contact resistance between the members even with a low contact surface pressure, and to provide a conductive connection structure with the conductive uneven layer.SOLUTION: The conductive unevenness layer 1 in which countless number of needle-like or cone-shaped projections 1a with a sharp tip are arrayed is formed on a contact surface between a conductive porous material member 3 and a conductive member 2. |
