发明名称 水素充填システム
摘要 A temperature sensor excellent in durability under a high-pressure atmosphere of hydrogen is provided. The temperature sensor includes a thermistor element body comprising an oxide sintered body, a pair of lead wires each electrically connected to the element body and comprising Pt or a Pt alloy, and a sealing glass sealing the element body and a part of the lead wires including a portion connected to the element body. The pair of lead wires comprising any of Pt, an alloy comprising Pt and one or two of Ir and Pd, and an alloy of Pd and Ir, and the temperature sensor is used under an atmosphere of hydrogen.
申请公布号 JP5847517(B2) 申请公布日期 2016.01.20
申请号 JP20110212449 申请日期 2011.09.28
申请人 株式会社芝浦電子 发明人 越水 和人;中谷 孝之;内山 聡
分类号 G01K7/22;G01K1/14;G01K13/02 主分类号 G01K7/22
代理机构 代理人
主权项
地址