| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component in which a flexible substrate is reinforced with electronic component elements in a portion where the electronic component elements are mounted and the flexible substrate is easily bent in a portion except the portion where the electronic component elements are mounted. <P>SOLUTION: An electronic component 10 includes, for example, a multi-layer flexible substrate 12. An IC 16 and a chip capacitor 16' are mounted as electronic component elements on the surface side of the flexible substrate 12. Reinforcement members 18 and 18' are respectively formed on a surface of the flexible substrate 12 facing the body part 16a of the IC 16 and the body part 16a' of the chip capacitor 16'. <P>COPYRIGHT: (C)2013,JPO&INPIT |
