发明名称 |
STRUCTURE FOR BONDING METAL PARTS TO EACH OTHER AND BONDING METHOD THEREFOR |
摘要 |
A flange 24 is provided around a metal cap 21. A wire 25 is disposed on a bottom surface of the flange 24 while formed into a circular shape. Preferably the wire 25 is tack-welded to the bottom surface of the flange 24. The wire 25 to be used has a melting point within a range of -150°C to +150°C with respect to melting points of the metal cap 21 and a metal base 22. The flange 24 of the metal cap 21 and the metal base 22 overlap each other with the wire 25 sandwiched therebetween. Then a current is passed between the flange 24 of the metal cap 21 and the metal base 22 to melt the wire 25, whereby the flange 24 and the metal base 22 are resistance-welded to each other. |
申请公布号 |
EP2974821(A1) |
申请公布日期 |
2016.01.20 |
申请号 |
EP20140763939 |
申请日期 |
2014.02.18 |
申请人 |
OMRON CORPORATION |
发明人 |
YOSHIOKA, HIDEKAZU;NAGASAKA, SHOGO;TSUCHIDA, MAKOTO;YOSHIDA, HITOSHI |
分类号 |
B23K11/00;B23K11/14;B23K11/16;B23K35/02;H01H11/00;H01H49/00;H01H50/02 |
主分类号 |
B23K11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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