发明名称 貫通電極基板及び貫通電極基板を用いた半導体装置
摘要 A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.
申请公布号 JP5846185(B2) 申请公布日期 2016.01.20
申请号 JP20130241392 申请日期 2013.11.21
申请人 大日本印刷株式会社 发明人 倉持 悟;小岩 進雄;吉岡 英範
分类号 H01L23/32 主分类号 H01L23/32
代理机构 代理人
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