| 摘要 |
PURPOSE: A phenol resin provides a thermoplastic resin composition with excellent flexibility and manufactures a cured material with excellent heat resistance and moisture resistance. CONSTITUTION: A phenol resin includes 50-90 wt% of a phenolic hydroxyl group-containing compound (A) which is formed by the reaction of a phenol and an acetone under an acid; and 10-50 wt% of a nitrogen-containing phenol resin (B) which is formed by the reaction of a phenol and the dimethylol of a nitrogen-containing compound. The phenol for forming the compound A is resorcinol. A thermosetting resin composition includes the phenol resin and an epoxy resin. The amount of the phenol resin used is 0.6-1.2 equivalent with regard to 1.0 equivalent of the epoxy resin. |
