发明名称 |
WAFER MAPPING PROCESS CONTROL WITH INDICATOR LINE |
摘要 |
<p>A method for providing alignment in a die picking process may include aligning a semiconductor wafer based on a reference die, forming an indicator line relative to the reference die by picking a number of dice along a line extending across the wafer, and using the reference line to monitor a position of the picking machine relative to the wafer. A die attach machine may include a control system for automatically implementing such method.</p> |
申请公布号 |
EP2973675(A1) |
申请公布日期 |
2016.01.20 |
申请号 |
EP20140715160 |
申请日期 |
2014.03.06 |
申请人 |
MICROCHIP TECHNOLOGY INCORPORATED |
发明人 |
GIBSON, MATTHEW;NA-NAMCHIEW, PREM;KENGANANTANON, EKGACHAI;BUNKER, MATTHEW |
分类号 |
H01L21/67;H01L21/68 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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