发明名称 部品実装装置及び部品実装方法
摘要 PROBLEM TO BE SOLVED: To provide a part mounting device and a part mounting method that can reduce a recognition frequency of a board with respect to a positioning frequency of the board, enhance teh productivity of the board by shortening a working time, and simplify the device construction.SOLUTION: A board 2 is recognized to achieve information concerning a position of the board under the state that a board holding state 53 is moved to a part mount working portion 22b, and the board holding stage 53 is moved on the basis of the achieved information to position the board 2 with respect to the part mount working portion 22b. After a mount work of the part 4 on the board 2 is performed by the part mount working portion 22b, the board holding stage 53 is moved to a part press-fitting working portion (first part press-fitting working portion 22c or a second part press-fitting working portion 22d), the board holding stage 53 is moved on the basis of the achieved information to position the board 2 with respect to the part press-fitting working portion, and a press-fitting work of the part 4 to the board 2 is performed by the part press-fitting working portion.
申请公布号 JP5845417(B2) 申请公布日期 2016.01.20
申请号 JP20120192890 申请日期 2012.09.03
申请人 パナソニックIPマネジメント株式会社 发明人 味村 好裕;浜田 隆二;亀田 明
分类号 H05K13/04;G02F1/13;G02F1/1345;H05K3/32;H05K13/08 主分类号 H05K13/04
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