| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ablation method for a DAF (die attach film) capable of reliably dividing the DAF corresponding to individual device. <P>SOLUTION: The ablation method for a die attach film comprises applying a laser beam to the film to perform ablation. The method includes: a protective film-forming step of applying a liquid resin containing the fine powder of carbides having absorptivity to the wavelength of the laser beam to at least a subject area of the film to be ablated, to form a protective film containing the fine powder; and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the film after performing the protective film-forming step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
