| 摘要 |
[Problem] To provide a mounting device and a mounting method that can successfully thermally compress, onto a substrate, even a chip on which a minute solder bump is formed. [Solution] Provided are a mounting device and a mounting method that thermally compress a solder bump formed on a chip onto an electrode formed on a substrate by pressing and heating the solder bump, the mounting device and the mounting method including: a thermal compression tool for holding the chip and pressing the chip onto the substrate; a substrate stage for holding the substrate; a heating means for heating the thermal compression tool; and a control unit for controlling the height of the thermal compression tool. The control unit has functions of: lowering the thermal compression tool holding the chip; pushing the chip into the electrode formed on the substrate by a predetermined amount, using the thermal compression tool after the solder bump formed on the substrate side of the chip comes into contact with the electrode formed on the substrate; and heightening the location of the thermal compression tool in accordance with a stretch of the thermal compression tool before the temperature of the solder bump reaches the solder melting temperature. |
