发明名称 |
Method for curing UV-curable resin and method for packaging OLED |
摘要 |
The present invention provides a method for curing a UV-curable resin and a method for packaging an OLED. The method for curing a UV-curable resin includes (1) providing a UV light source and activating the UV light source to carry out a first irradiation operation on UV-curable resin; (2) de-activating the UV light source and, after a time interval of 10-300 seconds, activating the UV light source to carry out a second irradiation operation on the UV-curable resin; and (3) repeating step (2), until the UV-curable resin is completely cured. Interval-separated irradiation operations are applied so as to effectively lower down the temperature of a glass substrate and effectively avoid deterioration of an organic function layer caused by an excessively high temperature, thereby improving the lifespan and quality of an OLED device. |
申请公布号 |
US9240566(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201314236854 |
申请日期 |
2013.11.26 |
申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd. |
发明人 |
Yu Wei |
分类号 |
H01L21/02;H01L51/52;C03C17/00;H01L51/56 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
Cheng Andrew C. |
主权项 |
1. A method for curing a UV (Ultraviolet)-curable resin, comprising the following steps:
(1) providing a UV light source and activating the UV light source to carry out a first irradiation operation on a UV-curable resin having a predetermined quantity coated on a substrate; (2) de-activating the UV light source and, after a time interval of 10-300 seconds, activating the UV light source to carry out a second irradiation operation on the UV-curable resin, wherein the time interval between the de-activation of the first irradiation operation and the activation of the second irradiation operation is determined according to cooling rate of the substrate in order to control a maximum temperature of the substrate resulting from the irradiation operations to be lower than a predetermined level; and (3) repeating step (2) until the UV-curable resin is completely cured with the maximum temperature of substrate being controlled to be lower than the predetermined level. |
地址 |
Shenzhen, Guangdong CN |