Semiconductor packages having wire bond wall to reduce coupling

摘要

A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.

主权项

1. A device housed in an air cavity package, the device comprising:
a substrate having a top surface; one or more isolation structures over the top surface of the substrate, wherein an area over the top surface of the substrate within sidewalls of the one or more isolation structures defines an active circuit area; a first circuit over the top surface of the substrate within the active circuit area; a second circuit over the top surface of the substrate within the active circuit area and adjacent to the first circuit; a first lead coupled to a portion of the one or more isolation structures that is proximate to a first side of the package, wherein the first lead is electrically coupled to the first circuit; a second lead coupled to a portion of the one or more isolation structures that is proximate to a second side of the package, wherein the second lead is electrically coupled to the first circuit; a third lead coupled to the portion of the one or more isolation structures that is proximate to the first side of the package, wherein the third lead is electrically coupled to the second circuit; a fourth lead coupled to the portion of the one or more isolation structures that is proximate to the second side of the package, wherein the fourth lead is electrically coupled to the second circuit; a first terminal over the first side of the package between the first lead and the third lead; a second terminal over the second side of the package between the second lead and the fourth lead; a plurality of connection pads over the substrate and arranged in a row between the first circuit and the second circuit; and a wire bond wall coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals, wherein the wire bond wall includes a wire bond having a first end coupled to a first one of the connection pads and a second end coupled to a second one of the connection pads.