发明名称 Substrate treatment device and substrate treatment method
摘要 [Problem] To provide a substrate treatment device which can more efficiently heat and more efficiently use a treatment solution to treat the surface of a plate-shaped substrate.;[Solution] A substrate treatment device which is provided with a treatment solution feed mechanism 50 and feeds a treatment solution S to the surface of a plate-shaped substrate that is held on the substrate holding part 10 and which uses the treatment solution S to treat the surface of the plate-shaped substrate 100, which substrate treatment device has a treatment solution holding plate 15 which is arranged facing the surface of the plate-shaped substrate 100 that is held at the substrate holding part 10, across a predetermined distance, and which holds the treatment solution with the surface of the plate-shaped substrate 100 and a heating part 30 which contacts a predetermined region of the treatment solution holding plate 15, including a position corresponding to the axis of rotation of the substrate holding part 10, to heat the predetermined region and which treatment solution feed mechanism feeds the treatment solution S to the clearance between the surface of the plate-shaped substrate 100 which rotates together with the substrate holding part 10 and the treatment solution holding plate 15 which is heated by the heating part 20.
申请公布号 US9240314(B2) 申请公布日期 2016.01.19
申请号 US201113574328 申请日期 2011.01.20
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 Kurokawa Yoshiaki;Hamada Koichi;Kobayashi Nobuo;Nagashima Yuji
分类号 B08B3/00;H01L21/02;H01L21/67;G03F7/42 主分类号 B08B3/00
代理机构 Kratz, Quintos & Hanson, LLP 代理人 Kratz, Quintos & Hanson, LLP
主权项 1. A substrate treatment device which is provided with a treatment solution feed mechanism that feeds a treatment solution to a surface of a plate-shaped substrate that is held on a substrate holding part which is rotated about a predetermined axis of rotation and which uses the treatment solution to treat the surface of said plate-shaped substrate, said substrate treatment device comprising: a treatment solution holding plate which is arranged facing the surface of said plate-shaped substrate that is held on said substrate holding part, across a predetermined distance, so as to hold the treatment solution between the surface of said plate-shaped substrate and it; and a heating part which is in contact with a predetermined region of said treatment solution holding plate, including a position corresponding to the axis of rotation of said substrate holding part, to heat the predetermined region, wherein said treatment solution feed mechanism feeds the treatment solution to a clearance between the surface of said plate-shaped substrate which rotates together with the substrate holding part and the treatment solution holding plate which is heated by said heating part.
地址 Yokohama-shi JP