发明名称 |
Substrate treatment device and substrate treatment method |
摘要 |
[Problem] To provide a substrate treatment device which can more efficiently heat and more efficiently use a treatment solution to treat the surface of a plate-shaped substrate.;[Solution] A substrate treatment device which is provided with a treatment solution feed mechanism 50 and feeds a treatment solution S to the surface of a plate-shaped substrate that is held on the substrate holding part 10 and which uses the treatment solution S to treat the surface of the plate-shaped substrate 100, which substrate treatment device has a treatment solution holding plate 15 which is arranged facing the surface of the plate-shaped substrate 100 that is held at the substrate holding part 10, across a predetermined distance, and which holds the treatment solution with the surface of the plate-shaped substrate 100 and a heating part 30 which contacts a predetermined region of the treatment solution holding plate 15, including a position corresponding to the axis of rotation of the substrate holding part 10, to heat the predetermined region and which treatment solution feed mechanism feeds the treatment solution S to the clearance between the surface of the plate-shaped substrate 100 which rotates together with the substrate holding part 10 and the treatment solution holding plate 15 which is heated by the heating part 20. |
申请公布号 |
US9240314(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201113574328 |
申请日期 |
2011.01.20 |
申请人 |
SHIBAURA MECHATRONICS CORPORATION |
发明人 |
Kurokawa Yoshiaki;Hamada Koichi;Kobayashi Nobuo;Nagashima Yuji |
分类号 |
B08B3/00;H01L21/02;H01L21/67;G03F7/42 |
主分类号 |
B08B3/00 |
代理机构 |
Kratz, Quintos & Hanson, LLP |
代理人 |
Kratz, Quintos & Hanson, LLP |
主权项 |
1. A substrate treatment device which is provided with a treatment solution feed mechanism that feeds a treatment solution to a surface of a plate-shaped substrate that is held on a substrate holding part which is rotated about a predetermined axis of rotation and which uses the treatment solution to treat the surface of said plate-shaped substrate,
said substrate treatment device comprising: a treatment solution holding plate which is arranged facing the surface of said plate-shaped substrate that is held on said substrate holding part, across a predetermined distance, so as to hold the treatment solution between the surface of said plate-shaped substrate and it; and a heating part which is in contact with a predetermined region of said treatment solution holding plate, including a position corresponding to the axis of rotation of said substrate holding part, to heat the predetermined region, wherein said treatment solution feed mechanism feeds the treatment solution to a clearance between the surface of said plate-shaped substrate which rotates together with the substrate holding part and the treatment solution holding plate which is heated by said heating part. |
地址 |
Yokohama-shi JP |