Cavity package design

摘要

A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.

主权项

1. A semiconductor device, the device comprising:
a substrate having a first side and having electrical routing traces; at least one of a MEMS die and a semiconductor chip mounted on the first side of the substrate; and a spacer having a first end and a second end opposite the first end, the first end connected to the first side of the substrate and including electrical interconnects coupled to the electrical traces, the at least one MEMS die and a semiconductor chip contained within the spacer; a thin-film cover having a plurality of openings, the thin-film cover mounted on the second end of the spacer, the openings exposing the electrical interconnects; wherein the spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip, the cavity forming an acoustic volume; and wherein the semiconductor device is mounted to a circuit board via the second end of the spacer.