Surface inspection apparatus, method for inspecting surface, exposure system, and method for producing semiconductor device

摘要

A surface inspection apparatus includes: an irradiation unit; a detection unit configured to detect a first detection signal according to a first light beam and a second detection signal according to a second light beam; a providing unit which is configured to provide a first reference data and a second reference data; and a determination unit which is configured to determine a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal and the first reference data, and consistency between the second detection signal and the second reference data.

主权项

1. A surface inspection apparatus which inspects a surface of a substrate having a pattern formed thereon and processed under a predetermined processing condition, comprising:
an irradiation unit which illuminates, with an illumination light beam, a predetermined region of the surface of the substrate; a detection unit which detects a first detection signal according to a first light beam propagating in a first direction from the pattern within the predetermined region and a second detection signal according to a second light beam propagating in a second direction from the pattern within the predetermined region, the first direction being obtained so that a first diffraction condition is satisfied, the second direction being obtained so that a second diffraction condition is satisfied; a provide unit which is connected to the detection unit and which provides a first reference data and a second reference data with respect to at least one substrate having a plurality of patterns processed under a plurality of predetermined processing conditions, the first reference data indicating a relationship between the first detection signal detected by the detection unit and the plurality of predetermined processing conditions and the second reference data indicating a relationship between the second detection signal detected by the detection unit and the plurality of predetermined processing conditions; and a determination unit which is connected to the detection unit and which determines a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal for the inspection object substrate detected by the detection unit and the first reference data, and consistency between the second detection signal for the inspection object substrate detected by the detection unit and the second reference data.