发明名称 |
Power module and power conversion apparatus using same |
摘要 |
A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member. |
申请公布号 |
US9241429(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201214124172 |
申请日期 |
2012.05.22 |
申请人 |
Hitachi Automotive Systems, Ltd. |
发明人 |
Kaneko Yujiro;Suwa Tokihito;Hiramitsu Shinji;Shimura Takahiro |
分类号 |
H05K7/20;H02M7/00;B60L11/14;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
Crowell & Moring LLP |
代理人 |
Crowell & Moring LLP |
主权项 |
1. A power module comprising:
a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit; a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices; and a module case configured to accommodate the semiconductor devices and the conductive plates, wherein the module case includes, a heat radiation member made of plate-like metal and facing a surface of the conductive plate, and a metallic frame body having an opening portion that is closed by the heat radiation member, wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and the heat radiation member has a thermal conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member. |
地址 |
Hitachinaka-shi JP |