Substrate transport method, substrate transport apparatus, and coating and developing system

摘要

A substrate transporting method includes: after a holding unit of a substrate holding apparatus receives a substrate from one placement location for a substrate and holds it, detecting a first positional deviation of the substrate from a reference position of the substrate on the holding unit; transporting the substrate held by the holding unit to a position facing another placement location; detecting a second positional deviation of the substrate from the reference position of the substrate on the holding unit, when the substrate is located at the position facing the another placement location; calculating, based on the first and second positional deviations, a positional displacement of the substrate relative to the holding unit that occurred during the transporting of the substrate to the position facing the another placement location; and determining whether or not the positional displacement thus calculated falls within a predetermined range.

主权项

1. A substrate transport method that is performed in a substrate processing system, the substrate processing system including a substrate transport apparatus, which has a holding unit configured to hold the substrate by vacuum suction and which is configured to transport the substrate held by the holding unit, the substrate processing system further including a plurality of placement locations each allowing the substrate transported by the substrate transport apparatus to be placed thereon, said method comprising:
receiving the substrate placed on one of the plurality of placement locations by the holding unit and holding the substrate by vacuum suction; retracting the holding unit from the one placement location with the holding unit holding the substrate; detecting a first positional deviation of the substrate held by the holding unit from a reference position of the substrate on the holding unit; transporting the substrate held by the holding unit to a position facing another placement location; detecting a second positional deviation of the substrate held by the holding unit from the reference position of the substrate on the holding unit, when the substrate is located at the position facing said another placement location; calculating, based on the first and second positional deviations, a positional displacement of the substrate relative to the holding unit that occurred during the transporting of the substrate to the position facing the another placement location; and determining whether or not the positional displacement thus calculated falls within a predetermined range.