| 摘要 |
A probe unit for inspecting electronic component features is disclosed. The present invention comprises: a substrate with a via hole of which the inside is filled with a conductive material; and a contact film structure with a bump formed on the via hole, which is installed in the substrate. According to the present invention, provided is the probe unit for inspecting electronic component features which has high durability in case of generation of micro-cracks or the like despite a repetitive weight applied during a contact process with an electrode portion of an electrode panel. |
