Three dimensional integrated circuits

摘要

A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.

主权项

1. An integrated circuit comprising:
a substrate; a first plurality of layers including a first programmable circuit; a second plurality of layers including a pattern of metal layers based on a predetermined logical functionality for the integrated circuit; and a third plurality of layers including a second programmable circuit; wherein the first plurality of layers, the second plurality of layers, and the third plurality of layers are formed in a stacked manner, which utilizes a plurality of integrated circuit fabrication masks, on the substrate; and wherein the pattern of metal layers is configured to hard-wire the first programmable circuit and the second programmable circuit with the predetermined logical functionality by converting programmable logic to hard-wired logic.