发明名称 |
Method of fabricating thermal conductive polymer |
摘要 |
Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed. |
申请公布号 |
US9238879(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201414527426 |
申请日期 |
2014.10.29 |
申请人 |
SK INNOVATION CO., LTD. |
发明人 |
Moon Yongrak;Jung Kangmin |
分类号 |
D01F11/06;D01D5/06;D01F6/04;D01D5/16;D01F6/46 |
主分类号 |
D01F11/06 |
代理机构 |
Hauptman Ham, LLP |
代理人 |
Hauptman Ham, LLP |
主权项 |
1. A method of fabricating a thermal conductive polymer, comprising:
a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed. |
地址 |
Seoul KR |