发明名称 Method of fabricating thermal conductive polymer
摘要 Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.
申请公布号 US9238879(B2) 申请公布日期 2016.01.19
申请号 US201414527426 申请日期 2014.10.29
申请人 SK INNOVATION CO., LTD. 发明人 Moon Yongrak;Jung Kangmin
分类号 D01F11/06;D01D5/06;D01F6/04;D01D5/16;D01F6/46 主分类号 D01F11/06
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A method of fabricating a thermal conductive polymer, comprising: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.
地址 Seoul KR
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