发明名称 JOINING MATERIAL AND JOINING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a joining material capable of preventing deterioration in joining force due to the occurrence of cracking on a preliminarily dried film even if the preliminarily dried film is thickened and to provide a joining method using the same.SOLUTION: There is provided a joining material which is composed of a silver paste obtained by mixing silver particles having an average primary particle diameter of 1 to 200 nm coated with an organic compound having 8 or less carbon atoms such as sorbic acid and a solvent, where a diol such as octane diol is used as the solvent and a triol having a boiling point of 200 to 300°C, a viscosity at 20°C of 2000 to 10000 mPa and one or more methyl groups, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed as an additive.
申请公布号 JP2016008332(A) 申请公布日期 2016.01.18
申请号 JP20140130311 申请日期 2014.06.25
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 KURITA TORU;HINOTSU TAKASHI;ENDO KEIICHI;MIYOSHI HIROMASA
分类号 B22F9/00;B22F1/00;B22F1/02;B23K20/00;H01B1/22;H01L21/52 主分类号 B22F9/00
代理机构 代理人
主权项
地址