| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding mechanism for sticking tape capable of holding a wafer and an annular frame at positions suitable for sticking a tape.SOLUTION: A holding mechanism (2) for holding a wafer (11) and an annular frame when sticking a tape (17) to the annular frame (15) surrounding the wafer includes a wafer holding portion (4) having a wafer holding surface (8a) capable of suction holding the wafer, a frame holding portion (18) disposed to surround the wafer holding portion, and having a frame holding surface (22a) for holding the annular frame, a moving means (30, 40) for moving the wafer holding portions, respectively, in first and second horizontal directions while crossing perpendicularly to each other, and imaging means (26) disposed oppositely to the wafer holding surface, and imaging the wafer held on the wafer holding surface. |
