| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink capable of inhibiting heat from an electronic component from being conducted to a wiring board.SOLUTION: Disclosed is a heat sink which is connected to an electronic component 10 arranged to have a gap between a wiring board 20. The heat sink 200 has one end which is joined to the wiring board 20 and the other end to which terminals 12, 13 for energization of the electronic component 10 are joined. The heat sink is a plate material made of metal or made of an electrically conductive, heat conductive resin. The electronic component 10 is a power thermistor. |
