EPOXY RESIN AND ITS COMPOSITION, AND COMPOUND

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin that can exhibit an excellent toughness and adhesiveness while ensuring enough curability and heat resistance.SOLUTION: The epoxy resin and compound according to the invention is expressed by the predetermined general formula (1) as follows. The epoxy resin composition according to the invention comprises the above-mentioned epoxy resin and a curing agent. Moreover, a semiconductor sealing material according to the invention comprises the above-mentioned epoxy resin and is solid or liquid. Furthermore, a heat conducting material and a film-like adhesive according to the invention comprise the above-mentioned epoxy resin. In addition, an epoxy resin cured product according to the invention is obtained by curing the above-mentioned epoxy resin composition. G-SP1-MS-SP2-G (1).