| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head improved in heat responsiveness characteristic.SOLUTION: A thermal head X1 includes: a substrate 7 having a first main surface 7a, a second main surface 7b provided on an opposite side of the first main surface 7a, an inclined surface 7e inclined from the first main surface 7a, a first corner section 7f for connecting the first main surface 7a and the inclined surface 7e, an end face 7c for connecting the inclined surface 7e and the second main surface 7b, and a second corner section 7g for connecting the inclined surface 7e and the end face 7c; a first heat accumulation layer 13a provided on the inclined surface 7e; a heating section 9 provided on the first heat accumulation layer 13a; and a second heat accumulation layer 13b provided in a state separated from the first heat accumulation layer 13a on the first main surface 7a. A part of the second heat accumulation layer 13b is provided up to the inclined surface 7e. |
